Jobid: 3195965348 (0.11)
Overview
In this role you lead laser integration and packaging for integrated photonics, collaborating with internal and external partners to define packaging paths. You drive operational packaging workflows, develop next gen packaging technologies, and evaluate architectures for performance, cost, and manufacturability. You will own packaging campaigns, validate packaged chips in the lab, and share insights to mature packaging practices. This position offers impact across photonics applications and a chance to shape scalable packaging solutions.
Arbeidsvoorwaarden / Benefits
- 100% employer-paid pension plan
- flexible working hours
- training opportunities
- relocation support
- international work environment
- opportunity to impact future technologies
Verantwoordelijkheden
- Lead development of laser integration and packaging for integrated photonics, focusing on III-V to Silicon (Silicon Nitride) paths
- Own and manage packaging workflows with internal teams and external partners
- Create new packaging paths to improve operational excellence and meet new demands
- Establish and improve design-for-packaging guidelines (optical, electrical, thermal)
- Develop next generation packaging and integration technologies
- Evaluate packaging architectures for performance, cost, and manufacturability
- Plan, schedule, and execute packaging campaigns including yield analysis
- Demonstrate and validate packaged chips in a lab environment
- Share insights with the team and contribute to packaging maturity
- Prepare technical notes and documentation; optionally file patents or publish work
Belangrijkste vereisten
- MSc with 4+ years of experience or PhD in EE, physics, photonics, or ME
- Hands-on experience with semiconductor laser packaging (fiber coupling, butt coupling, laser assembly)
- Solid understanding of laser-related packaging processes
- Desirable: strong knowledge of electrical packaging and opto-electronic integration
- Plus: on chip laser coupling awareness
- Industry experience in photonics packaging; strong academic experience considered
- Experience with packaging design and mechanical CAD tools (e.g., SolidWorks 3D)
- Experience with high-speed interconnects; PIC design/characterization a plus
- Familiarity with photonic simulation tools (e.g., FDTD) a plus
- Project management skills a plus
- Strong written and verbal English communication
- self-driven
- ability to work with ambiguity
- effective communicator
- semiconductor laser packaging
- fiber coupling
- butt coupling
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